Technical Specifications
RDIMM for ASRock Rack 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X
Module Density: 32GB
Form Factor: RDIMM
Technology Speed: DDR5 6400MHz PC5-51200
Rank: 1Rx4
Voltage: 1.1V
ECC: ECC
Buffered: Registered/Buffered
Compatible With: ASRock Rack - 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X
Compatible Machines: ASRock Rack 6U8M-TURIN2 SYN MI350X, ASRock Rack 6U8M-TURIN2 SYN MI325X, ASRock Rack 6U8M-TURIN2 SYN MI300X
ASRock Rack 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X
The ASRock Rack 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X supports 24 slots of upgradable memory, with a maximum capacity of 3TB. It is compatible with our RDIMM modules for high-performance operation.
NEMIX RAM memory upgrades for the ASRock Rack 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X are backed by a lifetime replacement warranty.
Our modules are researched, matched, and compatibility-tested using top-tier components from leading suppliers such as Samsung, Micron, and Hynix, ensuring compliance with
industry standards like JEDEC and CE requirements.
Description
NEMIX RAM memory upgrades for the ASRock Rack 6U8M-TURIN2 SYN MI350X / 6U8M-TURIN2 SYN MI325X / 6U8M-TURIN2 SYN MI300X GPU servers: ECC Registered (RDIMM) modules from 32GB to 128GB, available at DDR5 6400MHz PC5-51200, selected as drop-in, compatibility-tested replacements. These systems each run dual AMD EPYC 9005/9004 (Socket SP5) processors with 24 DDR5 DIMM slots (one DIMM per channel), supporting up to 3TB of memory with RDIMM modules up to 128GB each. ASRock Rack positions the 6U Rackmount systems for AI Training and Inference, Intelligent Applications and High Performance Computing. Researched, matched, and compatibility-tested by NEMIX RAM, a US-based server memory specialist since 1993, and backed by a lifetime warranty. Volume, reseller, and B2B pricing available on request — contact our sales team for a quote.




